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Structure of 694-87-1
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Benzocyclobutene was used as the adhesive bonding material in adhesive wafer-level bonding technique. Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications. It was used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.
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GHS Pictogram :
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GHS No : GHS02
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Signal Word : Danger
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UN#: 3295
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Class : 3
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Packing Group : Ⅲ
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Hazard Statements : H225
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Precautionary Statements : P210-P233-P240-P241-P242-P243-P280-P370+P378-P501
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Lot numbers can be found on the outside label of a product: